BS-EN-IEC-62878-2-602 › Device embedding assembly technology

BS-EN-IEC-62878-2-602 - 2021 EDITION - CURRENT


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Device embedding assembly technology

Keywords

Components;Modules;Evaluation;Electronic equipment and components;Assembly

To find similar documents by classification:

31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS EN IEC 62878-2-602:2021

Revision Level

2021 EDITION

Status

Current

Publication Date

Aug. 20, 2021

Page Count

18

ISBN

9780539046458

International Equivalent

EN 62878-2-601 Ed.1.0;IEC 62878-2-601 Ed.1.0

Committee Number

EPL/501