BS-IEC-61189-5-4 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
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Printed circuits, Printed-circuit boards, Electronic equipment and components, Electrical insulating materials, Visual inspection (testing), Dimensional measurement, Chemical analysis and testing, Mechanical testing, Electrical testing, Environmental testing, Soldering, Fluxes (materials)
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BS IEC 61189-5-4:2015
Jan. 31, 2015