DD-IEC/PAS-61249-3-1 › Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
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Printed-circuit boards, Printed circuits, Printed-circuit bases, Coated materials, Copper, Laminates, Sheet materials, Foil, Flexible materials, Adhesives, Designations, Dimensions, Specification (approval)
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DD IEC/PAS 61249-3-1:2007
Oct. 31, 2007