DD-IEC/PAS-61249-3-1 Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

DD-IEC/PAS-61249-3-1 - 2007 EDITION - CURRENT


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Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Keywords

Printed-circuit boards, Printed circuits, Printed-circuit bases, Coated materials, Copper, Laminates, Sheet materials, Foil, Flexible materials, Adhesives, Designations, Dimensions, Specification (approval)

To find similar documents by classification:

31.180 (Printed circuits and boards)

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Price:

$228.80




Document Number

DD IEC/PAS 61249-3-1:2007

Revision Level

2007 EDITION

Status

Current

Publication Date

Oct. 31, 2007

Page Count

34

ISBN

9780580594724

International Equivalent

IEC/PAS 61249-3-1:2007

Committee Number

EPL/501