DD-IEC/PAS-62050 › Board level drop test method of components for handheld electronicproduc ts

DD-IEC/PAS-62050 - 2004 EDITION - SUPERSEDED -- See the following: BS-EN-60749-37
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Board level drop test method of components for handheld electronicproduc ts

Keywords

Semiconductor devices;Drop tests;Electronic equipment and components;Printed-circuit boards;Accelerated testing;Mechanical testing;Surface mounting devices;Impact testing

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31.080.01 (Semiconductor devices in general)

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Document Number

DD IEC/PAS 62050:2004

Revision Level

2004 EDITION

Status

Superseded

Publication Date

Jan. 11, 2006

Replaced By

BS EN 60749-37:2008;BS EN 60335-2-11:2001

Page Count

22

ISBN

0580459535

International Equivalent

IEC/PAS 62050:2004

Committee Number

EPL/47