DD-IEC/PAS-62137-3 › Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

DD-IEC/PAS-62137-3 - 2009 EDITION - SUPERSEDED -- See the following: BS-EN-62137-3
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Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

Keywords

Soldered joints;Life (durability);Electronic equipment and components;Solders;Integrated circuits;Surface mounting devices;Endurance testing;Environmental testing;Thermal testing;Printed-circuit boards;Soldering;Mechanical testing

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

DD IEC/PAS 62137-3:2008

Revision Level

2009 EDITION

Status

Superseded

Publication Date

Jan. 31, 2009

Replaced By

BS EN 62137-3:2012;BS EN 62137:2004

Page Count

46

ISBN

9780580641268

International Equivalent

IEC/PAS 62137-3:2008

Committee Number

EPL/501