EN-62137-3 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

EN-62137-3 - 2012 EDITION - CURRENT -- See the following: BS-EN-62137-3 DIN-EN-62137-3



Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints


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31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

EN 62137-3:2012

Revision Level

2012 EDITION

Status

Current

Publication Date

Jan. 20, 2012