IEC-60191-4 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

IEC-60191-4 - EDITION 3.1 - CURRENT -- See the following: IEC-60191-4-1 IEC-60191-4-2
Show Complete Document History

Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:

IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.



Want this as a site license?

To find similar documents by classification:

31.080 (Semiconductor devices Semiconducting materials, see 29.045)

31.080.01 (Semiconductor devices in general)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC 60191-4 Ed. 3.1 b:2018

Revision Level




Publication Date

March 1, 2018

Committee Number