IEC-60191-4 Complete Document History
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Complete Current Edition:
   EDITION 3.1 - CONSOLIDATES AMENDMENT 1 - March 1, 2018

Obsolete Revision Information:
   EDITION 3.0 - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages - Oct. 1, 2013
   EDITION 2.2 - CONSOLIDATES AMENDMENTS 1 & 2 - Oct. 1, 2002
   2ND EDITION - DEVICE PACKAGES, MECHANICAL ST - Oct. 1, 1999