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Complete Document History
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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Complete Current Edition:
EDITION 3.1 - CONSOLIDATES AMENDMENT 1 - March 1, 2018
Obsolete Revision Information:
EDITION 3.0 - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages - Oct. 1, 2013
EDITION 2.2 - CONSOLIDATES AMENDMENTS 1 & 2 - Oct. 1, 2002
2ND EDITION - DEVICE PACKAGES, MECHANICAL ST - Oct. 1, 1999