IEC-60191-5 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

IEC-60191-5 - EDITION 2.0 - CURRENT


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Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
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31.080 (Semiconductor devices Semiconducting materials, see 29.045)

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Document Number

IEC 60191-5 Ed. 2.0 b:1997

Revision Level

EDITION 2.0

Status

Current

Publication Date

April 4, 1997

Committee Number

47D