IEC-60191-6-18 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

IEC-60191-6-18 - EDITION 1.0 - CURRENT

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 ED 1.0 CORRIGENDUM 1 - May 1, 2010
 ED 1.0 CORRIGENDUM 2 - July 1, 2010

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.



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Document Number

IEC 60191-6-18 Ed. 1.0 b:2010

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Publication Date

Jan. 1, 2010

Committee Number