IEC-60191-6-21 › Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

IEC-60191-6-21 - EDITION 1.0 - CURRENT


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IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
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Document Number

IEC 60191-6-21 Ed. 1.0 b:2010

Revision Level

EDITION 1.0

Status

Current

Publication Date

Aug. 1, 2010

Committee Number

47D