IEC-60191-6-22 › Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

IEC-60191-6-22 - EDITION 1.0 - CURRENT


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IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
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Document Number

IEC 60191-6-22 Ed. 1.0 b:2012

Revision Level

EDITION 1.0

Status

Current

Publication Date

Dec. 11, 2012

Committee Number

47D