IEC-60191-6-8 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

IEC-60191-6-8 - 1ST EDITION - CURRENT


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IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
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Document Number

IEC 60191-6-8 Ed. 1.0 b:2001

Revision Level

1ST EDITION

Status

Current

Publication Date

Aug. 1, 2001

Committee Number

47D