IEC-60352-8 › Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance
IEC-60352-8
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EDITION 1.0
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CURRENT
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IEC 60352-8:2011 Is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.
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Document Number
IEC 60352-8 Ed. 1.0 b:2011
Revision Level
EDITION 1.0
Status
Current
Publication Date
Feb. 1, 2011
Committee Number
48B