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IEC-60749-15
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Complete Document History
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
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Complete Current Edition:
EDITION 3.0 - Part 15: Resistance to soldering temperature for through-hole mounted devices - July 1, 2020
Obsolete Revision Information:
EDITION 2.0 - Part 15: Resistance to soldering temperature for through-hole mounted devices - Oct. 1, 2010
1ST EDITION - SEMICONDUCTOR DEVICES - MECHAN - Feb. 1, 2003