IEC-60749-20-1-RL Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

IEC-60749-20-1-RL - EDITION 2.0 - CURRENT



Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat


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31.080.01 (Semiconductor devices in general)

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Document Number

S+ IEC 60749-20-1 Ed. 2.0 en:2019 (Redline version)

Revision Level

EDITION 2.0

Status

Current

Publication Date

June 1, 2019

Page Count

128 pages