IEC-60749-35 › Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
IEC-60749-35
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1ST EDITION
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CURRENT
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Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
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31.080.01 (Semiconductor devices in general)
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Document Number
IEC 60749-35 Ed. 1.0 b:2006
Revision Level
1ST EDITION
Status
Current
Publication Date
July 1, 2006
Committee Number
47