IEC-60749-37-RL Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

IEC-60749-37-RL - EDITION 2.0 - CURRENT



Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer


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Document Number

S+ IEC 60749-37 Ed. 2.0 en:2022 (Redline version)

Revision Level

EDITION 2.0

Status

Current

Publication Date

Oct. 1, 2022

Page Count

67 pages