IEC-60749-42 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

IEC-60749-42 - EDITION 1.0 - CURRENT


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IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
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Document Number

IEC 60749-42 Ed. 1.0 b:2014

Revision Level

EDITION 1.0

Status

Current

Publication Date

Aug. 12, 2014

Committee Number

47