IEC-60749-8 › Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

IEC-60749-8 - EDITION 1.0 - CURRENT


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 EDITION 1.0 - Aug. 1, 2002
 1ST EDITION CORRIGENDUM 1 - April 1, 2003
 1ST EDITION CORRIGENDUM 2 - Aug. 1, 2003

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.
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Document Number

IEC 60749-8 Ed. 1.0 b:2002

Revision Level

EDITION 1.0

Status

Current

Publication Date

Aug. 1, 2002

Committee Number

47