IEC-61188-1-2 Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

IEC-61188-1-2 - 1ST EDITION - CURRENT


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The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
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31.180 (Printed circuits and boards)

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Document Number

IEC 61188-1-2 Ed. 1.0 b:1998

Revision Level

1ST EDITION

Status

Current

Publication Date

April 1, 1998

Committee Number

91