IEC-61188-5-1 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

IEC-61188-5-1 - EDITION 1.0 - CURRENT


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Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
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31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC 61188-5-1 Ed. 1.0 b:2002

Revision Level

EDITION 1.0

Status

Current

Publication Date

July 1, 2002

Committee Number

91