IEC-61188-5-2 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

IEC-61188-5-2 - 1ST EDITION - CURRENT


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Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
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To find similar documents by classification:

31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC 61188-5-2 Ed. 1.0 b:2003

Revision Level

1ST EDITION

Status

Current

Publication Date

June 1, 2003

Committee Number

91