IEC-61188-5-6 › Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
IEC-61188-5-6
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1ST EDITION
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CURRENT
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Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC 61188-5-6 Ed. 1.0 b:2003
Revision Level
1ST EDITION
Status
Current
Publication Date
Jan. 1, 2003
Committee Number
91