IEC-61188-5-6 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

IEC-61188-5-6 - 1ST EDITION - CURRENT


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Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
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31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC 61188-5-6 Ed. 1.0 b:2003

Revision Level

1ST EDITION

Status

Current

Publication Date

Jan. 1, 2003

Committee Number

91