IEC-61188-6-1 › Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
IEC-61188-6-1
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EDITION 1.0
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CURRENT
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IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
To find similar documents by classification:
31.180 (Printed circuits and boards)
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC 61188-6-1 Ed. 1.0 b:2021
Revision Level
EDITION 1.0
Status
Current
Publication Date
Feb. 1, 2021
Committee Number
91