IEC-61188-6-4 Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

IEC-61188-6-4 - EDITION 1.0 - CURRENT


Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

ORDER

Price:

$281.00        

To find similar documents by classification:

31.180 (Printed circuits and boards)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC 61188-6-4 Ed. 1.0 b:2019

Revision Level

EDITION 1.0

Status

Current

Publication Date

May 1, 2019

Committee Number

91