IEC-61189-1 › Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IEC-61189-1 - EDITION 1.1 - CURRENT
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This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.
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31.180 (Printed circuits and boards)

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Document Number

IEC 61189-1 Ed. 1.1 b:2001

Revision Level

EDITION 1.1

Status

Current

Publication Date

Nov. 1, 2001

Committee Number

91