IEC-61189-11 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
IEC-61189-11
-
EDITION 1.0
-
CURRENT
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IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
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31.180 (Printed circuits and boards)
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Document Number
IEC 61189-11 Ed. 1.0 b:2013
Revision Level
EDITION 1.0
Status
Current
Publication Date
May 7, 2013
Committee Number
91