IEC-61189-2-721 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

IEC-61189-2-721 - EDITION 1.0 - CURRENT


Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.
ORDER

Price:

$164.00        

To find similar documents by classification:

31.180 (Printed circuits and boards)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC 61189-2-721 Ed. 1.0 b:2015

Revision Level

EDITION 1.0

Status

Current

Publication Date

April 29, 2015

Committee Number

91