IEC-61189-3-719 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
IEC-61189-3-719
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EDITION 1.0
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CURRENT
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IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
To find similar documents by classification:
31.180 (Printed circuits and boards)
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Document Number
IEC 61189-3-719 Ed. 1.0 b:2016
Revision Level
EDITION 1.0
Status
Current
Publication Date
Jan. 1, 2016
Committee Number
91