IEC-61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC-61190-1-2 - EDITION 3.0 - CURRENT
Show Complete Document History

Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.



Want this as a site license?

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC 61190-1-2 Ed. 3.0 b:2014

Revision Level




Publication Date

Feb. 19, 2014

Committee Number