IEC-61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC-61190-1-2 - EDITION 3.0 - CURRENT
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IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.
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31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC 61190-1-2 Ed. 3.0 b:2014

Revision Level

EDITION 3.0

Status

Current

Publication Date

Feb. 19, 2014

Committee Number

91