IEC-61190-1-2 › Complete Document History
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Complete Current Edition:
   EDITION 3.0 - Part 1-2: Requirements for soldering pastes for high-quality - Feb. 19, 2014

Obsolete Revision Information:
   2ND EDITION - Part 1-2: Requirements for soldering pastes for high-quality - April 1, 2007
   1ST EDITION - Part 1-2: Requirements for soldering pastes for high-quality - March 1, 2002