IEC-61191-1 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC-61191-1 - EDITION 2.0 - CURRENT
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IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- reference standard IEC 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to IEC standards have been corrected;
- the use of lead-free alloys in the assembly have been added.
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To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

31.240 (Mechanical structures for electronic equipment)

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Document Number

IEC 61191-1 Ed. 2.0 b:2013

Revision Level

EDITION 2.0

Status

Current

Publication Date

May 21, 2013

Committee Number

91