IEC-61191-3 › Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
To find similar documents by classification:
31.240 (Mechanical structures for electronic equipment)
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Document Number
IEC 61191-3 Ed. 2.0 en:2017
Revision Level
EDITION 2.0
Status
Current
Publication Date
May 1, 2017
Committee Number
91