IEC-61191-7 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

IEC-61191-7 - EDITION 1.0 - CURRENT


Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
ORDER

Price:

$375.00        


Want this as a site license?

To find similar documents by classification:

31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC/TR 61191-7 Ed. 1.0 en:2020

Revision Level

EDITION 1.0

Status

Current

Publication Date

March 1, 2020

Committee Number

91