IEC-61191-7 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

IEC-61191-7 - EDITION 1.0 - CURRENT

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IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.



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31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC/TR 61191-7 Ed. 1.0 en:2020

Revision Level




Publication Date

March 1, 2020

Committee Number