IEC-61192-2 › Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
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Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
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31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC 61192-2 Ed. 1.0 b:2003
Revision Level
EDITION 1.0
Status
Superseded
Publication Date
March 1, 2003
Committee Number
91