IEC-62137-3 › Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

IEC-62137-3 - EDITION 1.0 - CURRENT


Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.
ORDER

Price:

$337.56        


Want this as a site license?

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC 62137-3 Ed. 1.0 b:2011

Revision Level

EDITION 1.0

Status

Current

Publication Date

Nov. 1, 2011

Committee Number

91