IEC-62137-4 › Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

IEC-62137-4 - EDITION 1.0 - CURRENT


Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004:
- test conditions for use of lead-free solder are included;
- test conditions for lead-free solders are added;
- accelerations of the temperature cycling test for solder joints are added.
ORDER

Price:

$337.56        


Want this as a site license?

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC 62137-4 Ed. 1.0 b:2014

Revision Level

EDITION 1.0

Status

Current

Publication Date

Oct. 9, 2014

Committee Number

91