IEC-62866 › Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

IEC-62866 - EDITION 1.0 - CURRENT


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IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
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31.180 (Printed circuits and boards)

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Document Number

IEC/TR 62866 Ed. 1.0 b:2014

Revision Level

EDITION 1.0

Status

Current

Publication Date

May 7, 2014

Committee Number

91