IEC-62878-1-1 Device embedded substrate - Part 1-1: Generic specification - Test methods

IEC-62878-1-1 - EDITION 1.0 - CURRENT

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IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.



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31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC 62878-1-1 Ed. 1.0 b:2015

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Publication Date

May 20, 2015

Committee Number