IEC-62878-2-1 Device embedded substrate - Part 2-1: Guidelines - General description of technology

IEC-62878-2-1 - EDITION 1.0 - CURRENT


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IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
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31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC/TS 62878-2-1 Ed. 1.0 b:2015

Revision Level

EDITION 1.0

Status

Current

Publication Date

March 30, 2015

Committee Number

91