IEC-62878-2-602 › Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC-62878-2-602 - EDITION 1.0 - CURRENT


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IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
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31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC 62878-2-602 Ed. 1.0 b:2021

Revision Level

EDITION 1.0

Status

Current

Publication Date

June 1, 2021

Committee Number

91