IEC-62899-202-5 › Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

IEC-62899-202-5 - EDITION 1.0 - CURRENT


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IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

 

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31.180 (Printed circuits and boards)

87.080 (Inks. Printing inks Materials for graphic technology, see 37.100.20)

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Document Number

IEC 62899-202-5 Ed. 1.0 en:2018

Revision Level

EDITION 1.0

Status

Current

Publication Date

Sept. 1, 2018

Committee Number

119