IEC-63055 Format for LSI-Package-Board Interoperable design

IEC-63055 - EDITION 2.0 - CURRENT
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IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
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31.180 (Printed circuits and boards)

31.200 (Integrated circuits. Microelectronics Including electronic chips, logical and analogue microstructures Microprocessors, see 35.160)

35.060 (Languages used in information technology)

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Document Number

IEC 63055 Ed. 2.0 en:2023

Revision Level

EDITION 2.0

Status

Current

Publication Date

Oct. 1, 2023

Committee Number

91