IEC-63378-2-1 › Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

IEC-63378-2-1 - EDITION 1.0 - CURRENT


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IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
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Document Number

IEC 63378-2-1 Ed. 1.0 en:2024

Revision Level

EDITION 1.0

Status

Current

Publication Date

Oct. 1, 2024

Committee Number

47D