IEC/PAS-61249-3-1 › Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:
The following bibliographic material is provided to assist you with your purchasing decision:
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
To find similar documents by classification:
31.180 (Printed circuits and boards)
This document comes with our free Notification Service, good for the life of the document.
This document is available in either Paper or PDF format.
Document Number
IEC/PAS 61249-3-1 Ed. 1.0 en:2007
Revision Level
1ST EDITION
Status
Superseded
Publication Date
May 1, 2007
Committee Number
91