IPC-4203 › Complete Document History
Cover and Bonding Material for Flexible Printed Circuitry

Complete Current Edition:
   REVISION B - Cover and Bonding Material for Flexible Printed Circuitry - March 1, 2018

Obsolete Revision Information:
   REVISION A - Cover and Bonding Material for Flexible Printed Circuitry - Jan. 1, 2013
   DOD ADOPTION - FYI ONLY: DOD ADOPTED - Feb. 26, 2003
   BASE - ADHESIVE COATED DIELECTRIC - May 1, 2002