IPC-A-600 Acceptability of Printed Boards

IPC-A-600 - REVISION J - CURRENT
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This document is also known as: IPC-A-600H


Acceptability of Printed Boards

Abstract

The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 90 new or revised photographs and illustrations, revision H provides new coverage on topics such as copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation along with updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits. The document sychronizes to the acceptability requirements expressed in IPC-6012C and IPC-6013B.


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Document Number

IPC-A-600

Revision Level

REVISION J

Status

Current

Publication Date

May 1, 2016

Page Count

180 pages