IPC-M-103 Complete Document History
Standards for Surface Mount Assemblies


Obsolete Revision Information:
   IPC-T-50F - TERMS & DEFINITIONS FOR INTERC - Jan. 1, 1996
   IPC-CM-770D - GUIDELINES FOR PRINTED BOARDS - Jan. 1, 1996
   J-STD-001 - REQUIREMENTS FOR SOLDERED - Jan. 1, 1995
   IPC-SM-786A - CHARACTERIZING & HANDLING - Jan. 1, 1995
   IPC-A-610B - ACCEPTABILITY OF ELECTRONIC - Dec. 1, 1994
   IPC-SM-782A - SURFACE MOUNT DESIGN & LAND - Aug. 1, 1993
   IPC-S-816 - SMT PROCESS GUIDELINE - July 1, 1993
   IPC-SM-785 - ACCELERATED RELIABILITY - Nov. 1, 1992
   IPC-MC-790 - MULTICHIP MODULE - Aug. 1, 1992
   IPC-T-50E - STANDARDS FOR SURFACE MOUNT AS - July 1, 1992
   J-STD-002 - SOLDERABILITY TEST FOR - April 1, 1992
   IPC-SM-784 - CHIP-ON-BOARD TECHNOLOGY - Nov. 1, 1990
   IPC-C-406 - DESIGN & APPLICATION - Jan. 1, 1990
   IPC-SM-817 - DIELECTRIC REQUIREMENTS - Nov. 1, 1989
   J-STD-013 - IMPLEMENTATION OF BALL GRIND - July 1, 1989
   IPC-SMCTR001 - INTRODUCTION TO TAPE - Jan. 1, 1989
   IPC-SM-780 - COMPONENT PACKAGING - March 1, 1988
   IPC-R-700C - SUGGESTED GUIDELINES - Jan. 1, 1988
   J-STD-012 - IMPLEMENTATION OF FLIP CHIP - Jan. 1, 1986