IPC/EIA-J-STD-030 › Selection and Application of Underfill Material for Flip Chip and Other Micropackages
IPC/EIA-J-STD-030
-
RENUMBERED SEE
-
CURRENT
-- See the following:
IPC-J-STD-030
Show Complete Document History
Show Complete Document History
Selection and Application of Underfill Material for Flip Chip and Other Micropackages
Customers who bought this document also bought:
IPC-A-610Acceptability of Electronic Assemblies (Hardcopy format)
IPC-A-600
Acceptability of Printed Boards
IPC-6012
Qualification and Performance Specification for Rigid Printed Boards
Document Number
IPC/EIA-J-STD-030
Revision Level
RENUMBERED SEE
Status
Current
Publication Date
March 1, 2014