IPC/EIA-J-STD-030 Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

IPC/EIA-J-STD-030 - REVISION A - CURRENT
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Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages


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Document Number

J-STD-030A

Revision Level

REVISION A

Status

Current

Publication Date

March 1, 2014